- Std board level heatsinks including BGA and discrete semi-conductor types
- Thermal extrusions
- Bonded fin heatsinks
- Folded fin heatsinks
- Zipper fin heatsinks
- Liquid cooling solutions including cold plates and heat pipes
- Die casting
- Thermal assemblies
Thermal Interface Materials: Silicon based Gap filler pads, Gaskets, Grease, Putty & Rolls. Non-Silicone products,
Thin Films, Double Sided Adhesives.
Connectors: Zebra Strips Carbon,
Gold & Silver.
Connector & Microwave Components:
Automotive, Board to Board, Cable/Flex to Board, Circular, Co-Ax/RF, Fiber, High Speed, I/O, LCD, Memory, Modular & Power solutions.
- EMI Gaskets
- Circuit Board Shielding
- Conductive Elastomers
- Ferrites & RF Absorbers
