Leader Tech Enclosure Shielding Solutions
Leader Tech will cover types of enclosure shielding solutions available and how to select them, based on operating and cycling environments, material compatibilities and mounting methods.
Fujipoly Understanding Thermal Gap Filler Pads, PCB Deflection and Stress
Hirose Electric USA Choosing the Right Power Connection for your Application
Hirose will cover power connector design considerations such as physical, environmental and thermal as well as AWG vs Power vs Voltage.
Regional Sales Engineer
Graduated Summa cum loud from Southern New Hampshire University with a Bachelor of Science and Business Studies in Operations and Project Management. He also holds a Data and Telecommunications Certificate from the University of Massachusetts Lowells. Dave has been with Hirose for almost 4 years.
Leader Tech EMI Concepts and Board Shield Design Guidlines
Leader Tech will discuss EMI, the benefits of using circuit board shields , how to specify them and to lay them out on your PCB.
Chip Antenna Design & Validation Services for Wireless Applications
Johanson Technology will cover the selection of an antenna at concept stage and the tools available to finalize your design for production.
Fujipoly Fundamentals of Heat Transfer in Gap Filler Materials
Fujipoly will focus on the primary function of a thermal gap filler, how to select & specify TIMs for your application and what tools & resources are available to assist you in making a selection.