Fujipoly Understanding Thermal Gap Filler Pads, PCB Deflection and Stress


About This Webinar

Managing compression force and stress is critical in any application that incorporates gap filler pads as a thermal interface. In this webinar, Fujipoly will look at the compression characteristics of thermal gap filler pads and apply this understanding to a PCB assembly. Webinar attendees will have a better understanding of the basic analytical techniques and tests that can be performed to understand stress as well as defection in both gap filler pads and PCBs.

Christian Miraglia

Application Engineering Manager
Christian is a graduate of the New Jersey Institute of Technology and has over 15 years of experience working with Thermal interface Materials.

Leader Tech Enclosure Shielding Solutions


About This Webinar

In this webinar, Leader Tech will cover types of enclosure shielding solutions available and how to select them, based on operating and cycling environments, material compatibilities and mounting methods.

Joshua Chastain

Applications Engineer
Holds a B.S. in Mechanical Engineering from Florida State University and has been with Leader Tech for 8 years.